Use this URL to cite or link to this record in EThOS: https://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.785407
Title: Embedding electronic circuitry into a metal matrix via ultrasonic additive manufacturing : material considerations and process development
Author: Bournias-Varotsis, Alkaios
ISNI:       0000 0004 7970 9257
Awarding Body: Loughborough University
Current Institution: Loughborough University
Date of Award: 2018
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Abstract:
Ultrasonic Additive Manufacturing (UAM) is a hybrid metal additive manufacturing process, based on the layer-by-layer ultrasonic welding of thin metal foils and the periodic CNC machining of the bonded layers to achieve the desired three-dimensional geometry. Bonding in UAM occurs in the solid state and at low temperature, making UAM a potential technology for embedding electronic circuitry into metal structures. Printed Electronics (PE) is a family of processes that can fabricate electronic circuitry and components by directly dispensing functional materials onto a substrate. PE technologies have a high potential for integration with additive manufacturing processes, as they both follow similar basic manufacturing principles. Such integration can enable the fabrication of multi-functional parts with embedded electronic circuitry.
Supervisor: Not available Sponsor: EPSRC
Qualification Name: Thesis (Ph.D.) Qualification Level: Doctoral
EThOS ID: uk.bl.ethos.785407  DOI: Not available
Keywords: Mechanical Engineering not elsewhere classified ; Ultrasonic additive manufacturing ; Printed electronics ; Embedded electronics ; Form-then-bond
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