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Title: Effects of temperature on gold single crystal electrochemistry
Author: Reichenbach, L.
ISNI:       0000 0004 7656 7572
Awarding Body: University of Liverpool
Current Institution: University of Liverpool
Date of Award: 2018
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While most industrial processes that include metal deposition use elevated temperatures, the majority of scientific investigations are done at room temperature. Thus, an electrochemical study of the effect of the temperature on the metal deposition was seen as necessary. For a basic study, the underpotential deposition (UPD) was chosen to be investigated as a controlled amount of metal can be deposited. The copper underpotential deposition (Cu-UPD) on Au(111) in sulphuric acid was chosen due to being a well-known model system. As the sulphate anion strongly influences the UPD process, perchloric acid was also studied to investigate the dependence on the strength of the adsorbing anion. To see whether or not the temperature dependence was only due to the metal deposition, the copper-free electrolytes were also investigated. For the metal-free electrolytes, only cyclic voltammetry was used. For the Cu-UPD the study used both cyclic voltammetry and chronoamperometry. The temperature range for the study was between 10°C and 55°C. It was found that the increase of the kinetic energy due to the increasing temperature affects the speed of the processes. Moreover, it affects the stability of the formed phases, especially for mobile adlayers. Additionally, alloying was seen for the Cu-UPD on Au(111) in perchloric acid.
Supervisor: Grunder, Yvonne ; Lucas, Chris Sponsor: Not available
Qualification Name: Thesis (Ph.D.) Qualification Level: Doctoral