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Title: Modelling and simulation of paradigms for printed circuit board assembly to support the UK's competency in high reliability electronics
Author: Wilson, Antony R.
Awarding Body: Loughborough University
Current Institution: Loughborough University
Date of Award: 2012
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The fundamental requirement of the research reported within this thesis is the provision of physical models to enable model based simulation of mainstream printed circuit assembly (PCA) process discrete events for use within to-be-developed (or under development) software tools which codify cause & effects knowledge for use in product and process design optimisation. To support a national competitive advantage in high reliability electronics UK based producers of aircraft electronic subsystems require advanced simulation tools which offer model based guidance. In turn, maximization of manufacturability and minimization of uncontrolled rework must therefore enhance inservice sustainability for 'power-by-the-hour' commercial aircraft operation business models.
Supervisor: Not available Sponsor: Not available
Qualification Name: Thesis (Ph.D.) Qualification Level: Doctoral
EThOS ID:  DOI: Not available
Keywords: SMT Reflow ; Solder paste printing ; Component placement ; Dynamic behaviour of components