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Title: Novel micro-engineered stencils for flip-chip bonding and wafer level packaging
Author: Kay, Robert William
ISNI:       0000 0004 2741 318X
Awarding Body: Heriot-Watt University
Current Institution: Heriot-Watt University
Date of Award: 2008
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No abstract available
Supervisor: Dhariwal, Resham S.; Desmulliez, Marc Y. P. Sponsor: MicroStencil Ltd
Qualification Name: Thesis (Ph.D.) Qualification Level: Doctoral
EThOS ID:  DOI: Not available