Use this URL to cite or link to this record in EThOS:
Title: Thermal management of solid state power switches
Author: Tighe, Christopher James Frederick
ISNI:       0000 0004 2709 3905
Awarding Body: University of Nottingham
Current Institution: University of Nottingham
Date of Award: 2011
Availability of Full Text:
Access from EThOS:
Access from Institution:
The transient temperature of solid state power switches is investigated using thermal resistance network modelling and experimental testing. The ability of a heat sink mounted to the top of the device to reduce the transient temperature is assessed. Transient temperatures for heat pulses of up to 100ms are of most interest. The transient temperature distribution inside a typical stack-up of a solid state power switch is characterised. The thermal effects of adding a heat sink to the top of the device are then assessed. A variety of heat sink thicknesses and materials are evaluated. Components of the device stack-up are varied in order to assess their affect on the effectiveness of the heat sink in reducing the device temperature. Thermal networks are successfully applied to model the transient heat conduction inside the stack-ups. This modelling technique allowed a good understanding of the thermal behaviour inside the stack-up and heat sink during the transient period. The concept of using a heat sink to suppress the transient temperature was validated experimentally on two types of solid state power switch.
Supervisor: Not available Sponsor: Not available
Qualification Name: Thesis (Ph.D.) Qualification Level: Doctoral
EThOS ID:  DOI: Not available
Keywords: TK7800 Electronics