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Title: A solder-pump through wafer interconnection technology for advanced packaging
Author: Gu, Jiebin
ISNI:       0000 0004 2692 6370
Awarding Body: Imperial College London
Current Institution: Imperial College London
Date of Award: 2010
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No abstract available
Supervisor: Not available Sponsor: Not available
Qualification Name: Not available Qualification Level: Doctoral
EThOS ID:  DOI: Not available