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Title: Flip chip assembled high-Q MEMS inductors on silicon for RFIC applications
Author: Zeng, Jun
ISNI:       0000 0001 3577 0142
Awarding Body: Heriot-Watt University
Current Institution: Heriot-Watt University
Date of Award: 2007
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Inductor is a key element for radio-frequency circuits. On-chip inductors of high quality factor (high-Q) are required for high-performance RFICs (Radio-Frequency Integrated Circuits) for next generation wireless communication systems. This thesis presents the theoretical and experimental studies of high-Q suspended inductors produced by flip chip assembly for multi-GHz RFIC applications. The effects of device and substrate parameters on the Q-factor of the inductor devices were studied by numerical simulation using Ansoft HFSS electromagnetic field simulation package. It was found that the detrimental effect ofthe low-resistivity substrate on the inductor's Qfactor can be significantly reduced using the suspended inductor design. Suspended inductor devices were realised using a flip chip assembly method. The gold and copper based inductor structures with the supporting pillars were fabricated on low-cost glass and flexible carriers using UV photolithography and electrofonning technique, and were then assembled onto low-resistivity silicon substrates using the gold-gold thennocompression bonding on a flip chip bond~r, .Individual and 2x2 arrays of meander and spiral inductors have been successfully fabricated with various air gap heights and conductor thicknesses.
Supervisor: Not available Sponsor: Not available
Qualification Name: Thesis (Ph.D.) Qualification Level: Doctoral
EThOS ID:  DOI: Not available