Use this URL to cite or link to this record in EThOS:
Title: Reliability study of non-conductive adhesive joints for fine-pitch microelectronics
Author: Chiang, Weng-Keong.
ISNI:       0000 0001 3543 8027
Awarding Body: Brunel University
Current Institution: Brunel University
Date of Award: 2007
Availability of Full Text:
Access from EThOS:
No abstract available
Supervisor: Not available Sponsor: Not available
Qualification Name: Thesis (Ph.D.) Qualification Level: Doctoral
EThOS ID:  DOI: Not available