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Title: A study of intermetallic compounds formation and growth in Sn-Ag-Cu lead-free solder joints
Author: Salam, Budiman.
ISNI:       0000 0001 3545 8896
Awarding Body: University of Greenwich
Current Institution: University of Greenwich
Date of Award: 2005
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No abstract available
Supervisor: Not available Sponsor: Not available
Qualification Name: Thesis (Ph.D.) Qualification Level: Doctoral
EThOS ID:  DOI: Not available