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Title: A novel chip-to-chip radiative interconnection technique for gigabit logic multi-chip modules using leaky wave antennas
Author: Iyer, Mahadevan Krishna
ISNI:       0000 0001 3587 6748
Awarding Body: Loughborough University of Technology
Current Institution: Loughborough University
Date of Award: 1994
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Multi-Chip Modules (MCMs) are considered as the next major step in the evolution of high performance microelectronic packaging. Advances in the performance of very high speed MCMs are limited by problems associated with interconnecting devices using metallic interconnects within the module. The need for faster interconnects for gigabit logic MCMs has been discussed in this thesis. Techniques to avoid the problem of taking high speed interconnections through multilayer substrates include radiative and optical techniques. The present research work concentrates on a radiative interconnection technique.
Supervisor: Not available Sponsor: Loughborough University ; Commonwealth Commission ; British Council ; Ministry of Human Resources and Development, India
Qualification Name: Thesis (Ph.D.) Qualification Level: Doctoral
EThOS ID:  DOI: Not available
Keywords: Components