Use this URL to cite or link to this record in EThOS: http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.697646
Title: Microwave assisted processing of metal loaded inks and pastes for electronic interconnect applications
Author: Qi, Siyuan
ISNI:       0000 0004 5993 5978
Awarding Body: Loughborough University
Current Institution: Loughborough University
Date of Award: 2014
Availability of Full Text:
Access through EThOS:
Access through Institution:
Abstract:
Isotropically conductive adhesives (ICAs) and inks are potential candidates for low cost interconnect materials and widely used in electrical/electronic packaging applications. Silver (Ag)filled ICAs and inks are the most popular due to their high conductivity and good reliability. However, the price of Ag is a significant issue for the wider exploitation of these materials in low cost, high volume applications such as printed electronics. In addition, there is a need to develop systems compatible with temperature sensitive substrates through the use of alternative materials and heating methods. Copper (Cu) is considered as a more cost-effective filler for ICAs and in this work, Cu powders were treated to remove the oxide layer and then protected with a self-assembled monolayer (SAM). The coating was found to be able to limit the re-oxidation of the Cumicron particles. The treated Cu powderswerecombined with one of two different adhesive resins to form ICAs that were stencil printed onto glass substrates before curing. The use of conventional and microwave assisted heating methods under an inert atmosphere for the curing of the Cu loaded ICAs was investigated in detail. The samples were characterised for electrical performance, microstructure and shrinkage as a function of curing temperature (80-150°C) and time. Tracks with electrical conductivity comparable to Ag filled adhesives were obtained for both curing methods and with both resins. It was found that curing could be accelerated and/or carried out at lower temperature with the addition of microwave radiation for one adhesive resin, but the other showed almost no absorption indicating a difference in curing mechanism for the two formulations.
Supervisor: Not available Sponsor: Materials Research School (MRS), Loughborough University
Qualification Name: Thesis (Ph.D.) Qualification Level: Doctoral
EThOS ID: uk.bl.ethos.697646  DOI: Not available
Keywords: Conductive adhesives ; Copper nano inks ; Microwave processing ; Resin curing mechanisms ; Sintering ; Conductivity ; Interconnects
Share: