Use this URL to cite or link to this record in EThOS: http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.636383
Title: Grain boundary engineering and the interfacial plane in copper
Author: Davies, P. A.
Awarding Body: University of Wales Swansea
Current Institution: Swansea University
Date of Award: 2000
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Abstract:
The field of Grain Boundary Engineering and the role and influence of the interfacial plane are explored in this thesis, which incorporates the results of two investigations. The Scanning Electron Microscopy (SEM) based technique of Electron Back-Scatter Diffraction (EBSD) provides the main experimental research tool and under-pins the Grain Boundary Design and Optimisation Investigation and the Interfacial Plane Geometry Investigation. The main aim of the Grain Boundary Design And Optimisation Investigation is to maximum the proportions of special boundaries in the grain boundary network and restrict the grain size using thermomechanical designs based on the principles of grain boundary engineering. Thermomechanical designs and processes wee used to alter the grain boundary network with the aim of maximising the proportion of special CSL grain boundaries in the grain boundary and triple junction character distributions in 99.9% pure copper. The Interfacial Plane Geometry Investigation focused on the characterisation of internal interfaces, specifically (Σ=3) annealing twin boundaries in heat-treated 99.99% pure copper. The characterisation of the five macroscopic degrees of freedom for Σ=3 grain boundaries in heat treated pure copper is measured using the combined techniques of serial sectioning and EBSD. The results of the Grain Boundary Design and Optimisation Investigation show that the thermomechanical designs and processes influence the grain boundary and triple junction character distributions in relation to the microtexture. Increasing the level of cold work resulted in weakening of the texture and conversely, increasing the annealing time for fixed temperature, resulted in a strengthening of the microtexture components with a small increase in grain size. Annealing copper in vacuum produces significant benefits in relation to the proportion of special grain boundaries in the grain boundary network and a linear relationship was found between the population of special grain boundaries and special triple junctions.
Supervisor: Not available Sponsor: Not available
Qualification Name: Thesis (Ph.D.) Qualification Level: Doctoral
EThOS ID: uk.bl.ethos.636383  DOI: Not available
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