Use this URL to cite or link to this record in EThOS: http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.575198
Title: Novel micro-engineered stencils for flip-chip bonding and wafer level packaging
Author: Kay, Robert William
Awarding Body: Heriot-Watt University
Current Institution: Heriot-Watt University
Date of Award: 2008
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Abstract:
No abstract available
Supervisor: Dhariwal, Resham S.; Desmulliez, Marc Y. P. Sponsor: MicroStencil Ltd
Qualification Name: Thesis (Ph.D.) Qualification Level: Doctoral
EThOS ID: uk.bl.ethos.575198  DOI: Not available
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