Use this URL to cite or link to this record in EThOS:
Title: Study of the Free Abrasive Grinding of Glass and Fused Silica.
Author: Phillips, K.
Awarding Body: University of Sussex
Current Institution: University of Sussex
Date of Award: 1975
Availability of Full Text:
Access from EThOS:
The mechanisms of material removal in the free abrasive grinding of glass and fused silica have been investigated 1n an attempt to understand the relationships between grinding rates and the physical and chemical properties of the abrasion system.' Free abrasive grinding was shown to be a process in which the abrasive particles rotate and indent the surface of the material being'ground. The impression left after indentation was surrounded by a residual stress field which initiated and propagated lateral vents that grew towards the surface forming chips. The volume of material removed in this manner has been related t-o the hardness and fracture toughness of the material being .ground. The number of particles indenting in unit ,time and :the load on those particles were found to depend on the H.quid in which the abrasive was suspended. Glass and fused silica showed a small difference in fracture behavionr,beneath a Vickers indenter, which was used to predict tbevariance in grindin·g rate of glass and fused silica as a function of the JlK)lecularweight·lnthe n-alcohol series. Mathematical models were used to relate the measured abrasion parameters (grinding rate, surface roughness, drag coefficient,bed-thickdess and number of interactions) to the angle through whicb the abrasive particles rotate. The viscosity of the carrier fluid probably determines the degree of rotation of the abrasive particles, but the mechanism of thiseavironmental Control is not fully understood.
Supervisor: Not available Sponsor: Not available
Qualification Name: Thesis (Ph.D.) Qualification Level: Doctoral
EThOS ID:  DOI: Not available