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Title: Properties and behaviour of PB-free solders in flip-chip scale solder interconnections
Author: Li, Dezhi.
Awarding Body: Loughborough University
Current Institution: Loughborough University
Date of Award: 2005
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No abstract available
Supervisor: Not available Sponsor: Not available
Qualification Name: Thesis (Ph.D.) Qualification Level: Doctoral
EThOS ID:  DOI: Not available