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Title: Wafer bonding technology for the production of dielectrically isolated silicon substrates incorporating buried metal silicide layers.
Author: Goh, Wang Ling.
Awarding Body: Queen's University of Belfast
Current Institution: Queen's University Belfast
Date of Award: 1995
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No abstract available
Supervisor: Not available Sponsor: Not available
Qualification Name: Thesis (Ph.D.) Qualification Level: Doctoral
EThOS ID:  DOI: Not available
Keywords: Components